The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jun. 24, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kavitha Nagarajan, Bangalore, IN;
Min Suet Lim, Gelugor, MY;
Eng Huat Goh, Ayer Itam, MY;
Telesphor Kamgaing, Chandler, AZ (US);
Chee Kheong Yoon, Bayan Lepas, MY;
Jooi Wah Wong, Bukit Mertajam, MY;
Chu Aun Lim, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10W 44/00 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 44/601 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 70/685 (2026.01); H10W 90/724 (2026.01);
Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.