Chee Hiong Chew

Title: Innovations by Chee Hiong Chew

Introduction

Chee Hiong Chew is a notable inventor based in Negeri Sembilan, Malaysia. He has made significant contributions to the field of electronics through his innovative patents. With a total of two patents to his name, Chee Hiong Chew has demonstrated his expertise in developing advanced packaging methods for electronic components.

Latest Patents

Chee Hiong Chew's latest patents include a leadframe and a method of manufacturing a leadframe. The first patent describes a method for packaging an electronic component using a leadframe that features at least one flag portion and one lead portion. The lead portion includes an end portion of reduced thickness adjacent to the flag portion, along with a channel that forms a locking step. This innovative design allows for efficient mounting and electrical connection of the electronic component, which is then encapsulated in a plastics molding compound. His second patent involves a leadframe structure with a movable sub-frame, which includes a main frame with longitudinal outer rails and a sub-frame that is bent in a zig-zag fashion. This design allows for overlapping flag and lead portions without affecting the dimensions of the main frame.

Career Highlights

Chee Hiong Chew is currently employed at Motorola Corporation, where he continues to work on innovative solutions in the electronics industry. His contributions have been instrumental in advancing the technology used in electronic packaging.

Collaborations

Some of Chee Hiong Chew's coworkers include Hin Kooi Chee and Saat Shukri Embong. Their collaboration has likely contributed to the successful development of innovative technologies within their field.

Conclusion

Chee Hiong Chew's work exemplifies the spirit of innovation in the electronics sector. His patents reflect a commitment to improving the efficiency and effectiveness of electronic component packaging.