The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 1999

Filed:

Jul. 25, 1997
Applicant:
Inventors:

Hin Kooi Chee, Seremban NS, MY;

Chee Hiong Chew, Seremban NS, MY;

Hou Boon Tan, Seremban NS, MY;

Robert J McLaughlin, Phoenix, AZ (US);

David M Culbertson, Tempe, AZ (US);

Alex J Elliott, Tempe, AZ (US);

Keng Guan Quah, Gilbert, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257666 ; 257676 ; 438123 ; 438111 ;
Abstract

A leadframe (1) includes a main frame having longitudinal outer rails (4) and a number of sub-frame (8) separated from the main frame by a slit (6) extending around at least part of the perimeter of the sub-frame (8). A plurality of flag portions (2), on which a semiconductor die is to be mounted, extend from the mainframe and a plurality of lead portions (12) extend from the sub-frame (8) towards the flag portions (2). The sub-frame (8) is bent twice in a zig-zag fashion so as to be in a plane parallel to that of the main frame so that the corresponding flag and lead portions overlap without affecting the dimensions of the outer edge portion of the main frame.


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