Hou Boon Tan

Title: The Innovative Contributions of Hou Boon Tan

Introduction

Hou Boon Tan is a notable inventor based in Seremban, Negeri Sembilan, Malaysia. He has made significant contributions to the field of semiconductor packaging, demonstrated by his patent for a unique leadframe structure. His work is emblematic of innovation within the electronics industry and reflects his commitment to advancing technology.

Latest Patents

Hou Boon Tan holds a patent for a "Leadframe Structure Having Moveable Sub-Frame." This innovative leadframe includes a main frame characterized by longitudinal outer rails, accompanied by multiple sub-frames that are strategically separated from the main frame by a slit. The design involves flag portions extending from the main frame, where semiconductor dies are mounted, and lead portions extending from the sub-frame toward these flag portions. The sub-frame's zig-zag design allows it to remain parallel to the main frame, facilitating overlap without altering the dimensions of the outer edge portion of the main frame. This invention enhances the efficiency and effectiveness of semiconductor packaging techniques.

Career Highlights

Hou Boon Tan is currently associated with Motorola Corporation, a prominent player in the telecommunications and electronics sector. His role within the company underscores his expertise in semiconductor technologies and his dedication to developing innovative solutions that advance the industry. Throughout his career, he has been instrumental in projects that have led to improvements in electronic devices, ensuring that they meet evolving market demands.

Collaborations

During his tenure at Motorola, Hou Boon Tan has worked alongside notable colleagues, including Hin Kooi Chee and Chee Hiong Chew. Their combined efforts reflect a collaborative approach to innovation, fostering an environment where ideas are nurtured and transformed into viable patents. This teamwork not only enhances their individual contributions but also propels the company forward in the competitive technology landscape.

Conclusion

Hou Boon Tan's contributions to the field of semiconductor packaging through his innovative leadframe structure demonstrate the impact of dedicated inventors on technology. His work at Motorola Corporation, alongside talented colleagues, highlights the importance of collaboration in driving forward the boundaries of innovation. As technology continues to evolve, the advancements made by inventors like Tan will play a crucial role in shaping the future of electronics.