The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 1999

Filed:

Jan. 04, 1999
Applicant:
Inventors:

Chee Hiong Chew, Negeri Sembilan, MY;

Hin Kooi Chee, Seremban, MY;

Saat Shukri Embong, Senawang Seremban, MY;

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
257676 ; 257666 ; 257669 ; 257672 ; 361813 ;
Abstract

In order to package an electronic component, a leadframe is provided having at least one flag portion (2) and at least one lead portion (7) extending towards the flag portion (2). The lead portion (7) includes an end portion (10) of reduced thickness adjacent the flag portion (2) and a channel (9) between the end portion (10) and the rest of the lead portion. The leadframe is etched to form the channel (9) and the end portion(10), which together form a locking step. The electronic component (3) is then mounted on the flag portion (2) and electrically connected to the end of the lead portion (7). The electronic component (3), the electrical connection (5), at least the end portion (10) and the intermediate portion (9) of the lead portion (7) and at least part of the flag portion (2) are encapsulated in a plastics molding compound, which enters and fills the locking step, and is then cured.


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