Chee Heng Wong

Title: **Chee Heng Wong: Innovator in Integrated Circuit Packaging**

Introduction

Chee Heng Wong, an accomplished inventor located in Perak, Malaysia, has made significant contributions to the field of integrated circuit packaging. With two patents to his name, he stands out for his innovative designs that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Wong's latest patents include "Multiple row exposed leads for MLP high density packages" and "Method of making the mould for encapsulating a leadframe package." The first patent focuses on a leadframe strip production process that allows for encapsulated semiconductor chips to feature multiple annular rows of exposed leads. By utilizing two types of frames, Wong's design optimizes the arrangement and connection of bonding pads, significantly improving the encapsulation process.

The second patent addresses the creation of a mould for encapsulating an integrated circuit package on a leadframe. This innovative mould design includes structures that effectively close off spaces between adjacent leads, allowing for minimal peripheral flanges and simplifying the overall molding process. Notably, the design enables leads to be extended out of the cavity without the necessity of creating a broad conventional flange.

Career Highlights

Chee Heng Wong currently works at Carsem (M) Sdn. Bhd., a company recognized for its advancements in semiconductor packaging and assembly services. Through his career at Carsem, Wong has exemplified a commitment to innovation, leading to his impactful patent filings.

Collaborations

During his tenure, Wong has collaborated with talented colleagues, including Kam Chuan Lau and Kok Siang Goh. Together, they have fostered a creative environment that encourages the development of cutting-edge technology in semiconductor applications.

Conclusion

Chee Heng Wong's pioneering work in the realm of integrated circuit packaging has not only led to the successful acquisition of patents but also significantly contributed to the advancement of semiconductor technologies. His innovations will likely influence the industry for years to come, showcasing the importance of creativity and collaboration in technological progress.