The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Jun. 15, 2004
Richard Mow Lum Yee, Perak, MY;
Chee Heng Wong, Perak, MY;
Chee Ching Yip, Perak, MY;
Sasidharan Suresh Dass, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Richard Mow Lum Yee, Perak, MY;
Chee Heng Wong, Perak, MY;
Chee Ching Yip, Perak, MY;
Sasidharan Suresh Dass, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Carsem (M) Sdn Bhd, Perak, MY;
Abstract
A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon the closure of said mould-halves, closes off the spaces between adjacent leads of the leadframe to allow only said leads to extend out of said cavity. The structures may be protrusions from the mould half closing off the spaces. Notches or slots cut to allow the leads' extension are the preferred structures due to ease of machining. The mould design thus enables a leadframe package to be moulded with a peripheral flange as narrow as desired without the need to cut a broad conventional flange formed up to the dam bar because only the leads and tie bars are left to be singulated. A method for making the above mould as well as singulation methods for cutting and punching the leads and tie bars is also disclosed.