The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Aug. 18, 2006
Mow Lum Yee, Perak, MY;
Chee Heng Wong, Perak, MY;
Shang Yan Choong, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Voon Joon Liew, Perak, MY;
Chee Sang Yip, Perak, MY;
Say Yeow Lee, Perak, MY;
Mow Lum Yee, Perak, MY;
Chee Heng Wong, Perak, MY;
Shang Yan Choong, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Voon Joon Liew, Perak, MY;
Chee Sang Yip, Perak, MY;
Say Yeow Lee, Perak, MY;
Carsem (M) SDN. BHD., Perak Darul Ridzuan, MY;
Abstract
A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.