Company Filing History:
Years Active: 2010
Title: The Contributions of Inventor Say Yeow Lee in Semiconductor Packaging
Introduction
Say Yeow Lee, an inventive mind based in Perak, Malaysia, has made notable strides in the field of semiconductor packaging. With a focus on developing innovative technologies, he holds a patent that enhances the efficiency and density of integrated circuit (IC) devices.
Latest Patents
Say Yeow Lee is the inventor of a patent titled "Multiple row exposed leads for MLP high density packages." This innovation introduces a leadframe strip production process that provides encapsulated semiconductor chips with more than two annular rows of exposed leads. The unique design utilizes two types of frames: the leadframe to which IC devices are mounted and a ring frame strip attached to the leadframe with a non-conductive adhesive. This setup includes die pads that receive the IC chip devices, strategically positioned within multiple rows of connecting pads for effective connections with bonding pads of the device to be encapsulated. The connecting pads are arranged in an annular fashion, optimizing the layout with inner rows closer to the die pad and outer rows farther away.
Career Highlights
Say Yeow Lee is currently employed at Carsem (M) Sdn. Bhd., where he continues to focus on advancing semiconductor packaging technologies. His dedication to innovation is evidenced through his work that significantly contributes to the semiconductor industry.
Collaborations
Throughout his career, Say Yeow Lee has collaborated with talented individuals such as Mow Lum Yee and Chee Heng Wong. Their teamwork reflects a commitment to pushing technological boundaries in their field, enhancing overall productivity and innovation at Carsem.
Conclusion
Say Yeow Lee exemplifies the spirit of innovation within the semiconductor industry. His patent on multiple row exposed leads for MLP high density packages not only contributes to improved chip encapsulation techniques but also lays the groundwork for future advancements. As he continues his work at Carsem, the impacts of his contributions are sure to resonate in the evolving landscape of semiconductor technologies.