Carsem (m) Sdn. Bhd.

Say Yeow Lee

Kok Siang Goh

Kam Chuan Lau

Shang Yan Choong

Voon Joon Liew

Mow Lum Yee

Chee Sang Yip

Chee Heng Wong

A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.

Multiple row exposed leads for MLP high density packages

Growing community of inventors

Perak, Malaysia

Say Yeow Lee