Company Filing History:
Years Active: 2010-2017
Title: Innovations from Mow Lum Yee: Revolutionizing Electronic Packaging
Introduction
Mow Lum Yee, an innovative inventor based in Perak, Malaysia, has made significant contributions to the field of electronics. With three patents to his name, he has developed advanced technologies that cater to the growing demands of the electronics industry. His expertise and creativity continue to influence the landscape of electronic packaging.
Latest Patents
Mow Lum Yee's latest patent, titled "Thin Plastic Leadless Package with Exposed Metal Die Paddle," outlines a method for producing electronic packages. This innovative approach involves utilizing a leadframe strip with multiple leadframes, each equipped with leads. The process includes etching a surface to form an opening for the die paddle, isolating the leads from the die paddle, and adhering a tape to the underside of the leadframe. Furthermore, Mow’s method incorporates attaching a die and placing ball bumps on lead tips, ensuring a robust electronic package design that streamlines manufacturing and enhances performance.
Career Highlights
Mow Lum Yee's career is marked by his role at Carsem (M) Sdn. Bhd., where he applies his inventive mindset to develop cutting-edge electronic packaging solutions. His dedication to innovation has earned him recognition within the company and the broader industry as he continues to push the boundaries of traditional electronic assembly techniques.
Collaborations
In his journey of innovation, Mow collaborates with skilled professionals such as Shang Yan Choong and Kam Chuan Lau. These partnerships foster an environment of creativity and knowledge sharing, ultimately leading to groundbreaking advancements in their projects and enhancing the overall contributions to electronic packaging.
Conclusion
Mow Lum Yee stands as a notable figure in the realm of electronic innovations. His pioneering work on thin plastic leadless packages demonstrates his commitment to advancing technology in the field. With an impressive portfolio of patents and collaborative efforts, he continues to pave the way for future inventions that will shape the electronics industry.