The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Oct. 30, 2007
Mow Lum Yee, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Shang Yan Choong, Perak, MY;
Voon Joon Liew, Perak, MY;
Chee Sang Yip, Perak, MY;
Mow Lum Yee, Perak, MY;
Kam Chuan Lau, Perak, MY;
Kok Siang Goh, Perak, MY;
Shang Yan Choong, Perak, MY;
Voon Joon Liew, Perak, MY;
Chee Sang Yip, Perak, MY;
Carsem (M) SDN. BHD., Ipoh Perak, MY;
Abstract
A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips.