Company Filing History:
Years Active: 2010-2017
Title: Innovations of Voon Joon Liew in Electronic Packaging
Introduction
Voon Joon Liew is a notable inventor based in Perak, Malaysia, recognized for his contributions to the field of electronic packaging. With a total of three patents to his name, he has made significant advancements in technology that enhance the performance and functionality of electronic devices.
Latest Patents
Among Voon Joon Liew's latest patents is the innovative "Thin Plastic Leadless Package with Exposed Metal Die Paddle." This patent outlines a method for creating electronic packages that includes several technical improvements. The method involves providing a leadframe strip containing multiple leadframes, each featuring a series of leads. The process begins with etching a surface of the leadframes to create an opening that connects each lead's tip to a die paddle. Each lead is isolated from the die paddle, allowing for effective adhesion of a tape to the bottom side of the leadframe. After attaching a die to the die paddle, ball bumps are placed on each lead tip, connecting the die to these bumps. The resulting electronic package is characterized by a leadframe with distinct leads and a die paddle, enhancing both functionality and reliability in electronic applications.
Career Highlights
Voon Joon Liew is primarily affiliated with Carsem (M) Sdn. Bhd., where his inventive work has contributed to the company's reputation for excellence in electronic manufacturing. His patents not only signify his innovation but also his commitment to advancing technology in the industry.
Collaborations
Throughout his career, Voon has collaborated with talented coworkers, including Mow Lum Yee and Shang Yan Choong. Their teamwork has fostered a collaborative environment that encourages creativity and innovation, resulting in impactful advancements within the field.
Conclusion
Voon Joon Liew stands out as a significant figure in the world of electronics, whose patents contribute to the efficient design and production of electronic packages. His work at Carsem (M) Sdn. Bhd. and collaborations with esteemed colleagues highlight his integral role in driving innovation forward in today's technology landscape.