Carsem (m) Sdn. Bhd.

Chee Heng Wong

Kok Siang Goh

Kam Chuan Lau

Shang Yan Choong

Voon Joon Liew

Mow Lum Yee

Chee Sang Yip

Richard Mow Lum Yee

Sasidharan Suresh Dass

Chee Ching Yip

Say Yeow Lee

A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.

Multiple row exposed leads for MLP high density packages

A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon the closure of said mould-halves, closes off the spaces between adjacent leads of the leadframe to allow only said leads to extend out of said cavity. The structures may be protrusions from the mould half closing off the spaces. Notches or slots cut to allow the leads' extension are the preferred structures due to ease of machining. The mould design thus enables a leadframe package to be moulded with a peripheral flange as narrow as desired without the need to cut a broad conventional flange formed up to the dam bar because only the leads and tie bars are left to be singulated. A method for making the above mould as well as singulation methods for cutting and punching the leads and tie bars is also disclosed.

Method of making the mould for encapsulating a leadframe package

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Perak, Malaysia

Chee Heng Wong