Company Filing History:
Years Active: 2017-2020
Title: Innovations by Chee Chung So in Semiconductor Technology
Introduction
Chee Chung So is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. With a total of 3 patents, he has made significant advancements in methods related to semiconductor devices and their packaging.
Latest Patents
His latest patents include innovative methods of making semiconductor devices. One of his patents describes a process that involves cutting kerfs in streets between regions of a semiconductor wafer. This method allows for the positioning of stacks of semiconductor dice on portions of surfaces of adjacent regions. A protective material is dispensed only between the stacks of semiconductor dice, over the exposed remainders of the regions, and in the kerfs. The back side of the semiconductor wafer is then ground to a final thickness, revealing the protective material in the kerfs at a side of the semiconductor wafer opposite the stacks of the semiconductor dice. Additionally, he has developed methods for protecting semiconductor devices, which involve cutting partially through a thickness of a semiconductor wafer to form trenches between stacks of semiconductor dice. A protective material is dispensed into these trenches, ensuring it reaches a level substantially the same as the height of the stacks of semiconductor dice.
Career Highlights
Chee Chung So is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of semiconductor technology. His work has contributed to the advancement of methods that enhance the efficiency and reliability of semiconductor devices.
Collaborations
Throughout his career, Chee Chung So has collaborated with talented individuals such as Zhaohui Ma and Wei Zhou, further enriching his work and contributions to the field.
Conclusion
Chee Chung So's innovative approaches to semiconductor technology have led to significant advancements in the industry. His patents reflect a commitment to improving the methods of making and protecting semiconductor devices, showcasing his expertise and dedication to innovation.