This inventor holds 6 USPTO granted patents and 4 published patent applications. Top assignee: Intel Corporation. Active years: 2019-2023.
Location History:
- Bayan Lepas, MY (2019 - 2021)
- Batu Maung Penang, MY (2022)
- Bayan Lepas Pulau Pinang, MY (2022 - 2023)
- Pinang, MY (2023)
Company Filing History:
Years Active: 2019-2023
Title: Chee Chun Yee: Innovator in Printed Circuit Board Technology
Introduction
Chee Chun Yee is a notable inventor based in Batu Maung, Malaysia. He has made significant contributions to the field of printed circuit board technology, holding a total of 6 patents. His innovative designs have the potential to enhance the functionality and efficiency of electronic devices.
Latest Patents
Among his latest patents is the "System in Package Dual Connector." This invention features a multilayer printed circuit board that includes a first printed circuit board portion with a first inserting connector and a plurality of contacts for creating a first removable bus connection. Additionally, it has a second printed circuit board portion with a second inserting connector and a third printed circuit board portion that connects the first and second portions. The design allows for foldability along the third printed circuit board portion, optimizing space and functionality. Another significant patent is the "Diagonal Printed Circuit Boards Systems," which enables laptops to have a smaller z-height by utilizing a motherboard assembly that positions components in an inclining manner within the laptop casing.
Career Highlights
Chee Chun Yee is currently employed at Intel Corporation, where he continues to innovate and develop advanced technologies. His work focuses on improving the design and efficiency of electronic components, particularly in the realm of printed circuit boards.
Collaborations
He collaborates with talented coworkers, including Min Suet Lim and Yew San Lim, who contribute to his projects and share a commitment to advancing technology in their field.
Conclusion
Chee Chun Yee's contributions to printed circuit board technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of electronic design and a commitment to enhancing the functionality of modern devices.