This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Che-Chi Wu: Inventor in Electronic Packaging
Introduction
Che-Chi Wu is an inventor associated with Taichung, Taiwan. His work includes an invention in electronic packaging designed to reduce electromagnetic interference.
Latest Patents
Wu is credited with 1 patent: “Electronic Package and Manufacturing Method Thereof.” The invention describes a package module and a shielding member placed on a carrier structure. The shielding member covers the module’s top and side surfaces to block outward radiation and help prevent electromagnetic interference from disrupting signal transmission by other electronic components on the carrier structure.
Career Highlights
Wu is associated with Siliconware Precision Industries, Ltd., a company involved in semiconductor packaging and testing. His patent reflects work on shielding approaches for electronic packages.
Collaborations
Wu’s listed coworker is Chien-Tang Li. Their association connects them to work on electronic packaging and electromagnetic shielding.
Conclusion
Che-Chi Wu’s patent addresses a practical challenge in electronic packaging by using a shielding member to limit interference and support reliable signal transmission.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile