The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Aug. 29, 2022
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Inventors:
Che-Chi Wu, Taichung City, TW;
Chien-Tang Li, Taichung City, TW;
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 44/20 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/15 (2026.01); H10W 76/63 (2026.01); H10W 76/67 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 40/037 (2026.01); H10W 40/22 (2026.01); H10W 44/20 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 90/701 (2026.01); H10W 44/209 (2026.01); H10W 44/248 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/15 (2026.01); H10W 76/63 (2026.01); H10W 76/67 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract
An electronic package is provided, in which a package module and a shielding member are disposed on a carrier structure, such that the shielding member covers a top surface and side surfaces of the package module to block the radiation outward from the package module and prevent problem that other electronic components on the carrier structure cannot be transmitted signals normally due to the electromagnetic interference of the package module.