This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2015-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015-2017
Title: Chau V Ho: Innovator in Thermal Management Technologies
Introduction
Chau V Ho is a notable inventor based in Auburn, WA (US), recognized for his contributions to the field of microelectronic assemblies. He holds 2 patents that focus on innovative solutions for heat dissipation in integrated circuit assemblies. His work is instrumental in enhancing the performance and reliability of electronic devices.
Latest Patents
Chau V Ho's latest patents include a heat dissipation device loading mechanism and a technique for heat removal in integrated circuit assemblies using a jumping-drops vapor chamber. The first patent describes a loading mechanism that incorporates at least one outrigger, which is rotatable or pivotable to accommodate various sizes or shapes of heat dissipation devices. The second patent outlines a vapor chamber apparatus designed to manage thermal energy effectively, utilizing a superhydrophobic surface to enhance the condensation process and improve heat removal efficiency.
Career Highlights
Chau V Ho is currently employed at Intel Corporation, where he applies his expertise in thermal management technologies. His innovative approaches contribute significantly to the development of advanced microelectronic systems, ensuring optimal performance under varying operational conditions.
Collaborations
Chau has collaborated with esteemed colleagues, including Feras Eid and Zhihua Li, to further advance the field of thermal management in electronics. Their combined efforts have led to significant advancements in the efficiency and effectiveness of heat dissipation technologies.
Conclusion
Chau V Ho's work exemplifies the importance of innovation in the realm of microelectronics. His patents and collaborations reflect a commitment to improving thermal management solutions, which are crucial for the future of electronic device performance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
