The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 04, 2013
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Feras Eid, Chandler, AZ (US);

Zhihua Li, Chandler, AZ (US);

Chau V. Ho, Auburn, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 2224/16 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/16152 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); Y10T 29/49002 (2015.01);
Abstract

Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.


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