Charles Poutasse

Title: Innovations by Charles Poutasse

Introduction

Charles Poutasse is an accomplished inventor based in Lake Oswego, Oregon. He has made significant contributions to the field of chemical mechanical polishing, particularly in the context of copper damascene processes. His innovative work has led to the development of a patented slurry that enhances the efficiency and effectiveness of polishing high-density copper interconnects.

Latest Patents

Poutasse holds a patent titled "Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics." This patent presents slurries and methods for polishing high-density copper interconnects in a low k interlayer dielectric (ILD). The slurry is formulated by combining a surfactant, such as glycolic acid ethoxylate lauryl ether (GAELE), with abrasives like silica, an oxidizing agent such as hydrogen peroxide, and a chelating buffer system including citric acid and potassium citrate. This innovative slurry minimizes bent line defects, erosion rates, and dishing rates on substrates.

Career Highlights

Charles Poutasse is currently employed at Intel Corporation, where he continues to advance his research and development efforts. His work at Intel has positioned him as a key player in the semiconductor industry, particularly in improving the processes involved in chemical mechanical polishing.

Collaborations

Poutasse collaborates with Anne E Miller, contributing to the innovative environment at Intel Corporation. Their partnership exemplifies the collaborative spirit that drives advancements in technology and innovation.

Conclusion

Charles Poutasse's contributions to the field of chemical mechanical polishing through his patented innovations demonstrate his expertise and commitment to enhancing semiconductor manufacturing processes. His work continues to influence the industry positively.