This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: ChangHwan Kim: Innovator in Integrated Circuit Packaging
Introduction
ChangHwan Kim is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, showcasing his expertise through innovative designs and methods.
Latest Patents
ChangHwan Kim holds a patent for an "Integrated circuit packaging system with plated copper posts and method of manufacture thereof." This invention includes a copper film, a first metal layer directly on the copper film, and an insulation layer with a via hole. The system also features a conductive via, a second metal layer, a copper post, a solder pad, and an interposer, all working together to enhance the efficiency of integrated circuit packaging.
Career Highlights
He is currently employed at Stats Chippac Pte. Ltd., where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing the technology used in integrated circuits, making them more efficient and reliable.
Collaborations
ChangHwan Kim has collaborated with talented coworkers such as Seong Won Park and Hun Teak Lee. Their combined efforts have contributed to the success of various projects within their field.
Conclusion
ChangHwan Kim's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence. His patent and ongoing work at Stats Chippac Pte. Ltd. highlight his role as a key player in the advancement of technology in this area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile