Changhwa Park

Title: Changhwa Park: Circuit Board Inventions

Introduction

Changhwa Park is an inventor based in Suwon, South Korea. His patent work focuses on circuit board structures and manufacturing methods. He is associated with Samsung Electro-Mechanics and has 2 patents listed in the information provided.

Latest Patents

**Circuit Board and Manufacturing Method Thereof.** This invention describes a circuit board with first and second insulation layers, circuit wiring, and a via hole whose side walls have different tilt angles. Seed layers cover the via hole and the upper surface of the second insulation layer, supporting conductive layers in the structure.

**Circuit Board and Manufacturing Method Thereof.** This invention describes a conductive layer on a first insulation layer, a via layer connecting the conductive layer to a wire layer beneath the insulation, and a trench extending from the conductive layer into at least part of the insulation layer.

Career Highlights

Park’s listed inventions address circuit board design and fabrication, including via connections, layered insulation, conductive structures, and trench formation. These features relate to the construction and manufacturing of multilayer circuit boards.

Collaborations

The provided information names Sangho Jeong and Yongduk Lee as Park’s coworkers. It does not specify whether they collaborated with him on either listed patent.

Conclusion

Changhwa Park’s listed patent work centers on circuit board structures and manufacturing techniques, reflecting his association with electronics innovation at Samsung Electro-Mechanics.