The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Sep. 06, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Sangho Jeong, Suwon-si, KR;
Jongeun Park, Suwon-si, KR;
Yongduk Lee, Suwon-si, KR;
Kihwan Kim, Suwon-si, KR;
Changhwa Park, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A circuit board includes a first insulation layer, a circuit wire positioned on the first insulation layer, a second insulation layer covering the circuit wire and overlapping a portion of the circuit wire, and having a via hole including a first side wall and a second side wall having different tilt angles and extending in the thickness direction of the first insulation layer, a first seed layer covering the first side wall and the second side wall of the via hole, a second seed layer positioned in the via hole and covering the first seed layer, a third seed layer positioned on an upper surface of the second insulation layer and including the same material as the second seed layer, a first conductive layer positioned on the second seed layer, and a second conductive layer positioned on the third seed layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile