The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Aug. 09, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Sangho Jeong, Suwon-si, KR;
Yongduk Lee, Suwon-si, KR;
Kihwan Kim, Suwon-si, KR;
Changhwa Park, Suwon-si, KR;
Hyun Hu Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); H05K 1/0284 (2013.01); H05K 3/0097 (2013.01);
Abstract
A disclosed circuit board may include: a first insulation layer, a conductive layer disposed on the first insulating layer; a first via layer disposed in the first insulating layer to be connected to the conductive layer; and a first wire layer disposed under the first insulating layer and connected to the first via layer, and a trench extending from the conductive layer to at least a portion of the first insulating layer may be disposed.