Singapore, Singapore

Changda Yao


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):

Title: Changda Yao - Innovator in Capacitor Manufacturing

Introduction

Changda Yao is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor technology. He has developed innovative methods that enhance the reliability and efficiency of capacitor structures. With a focus on improving capacitance density, his work has significant implications for the electronics industry.

Latest Patents

Changda Yao holds a patent for a "Method of manufacturing capacitor structure." This patent outlines a comprehensive process that includes several key steps. A substrate is provided, followed by the formation of a first doped silicon material layer on the substrate. A surface flattening process is performed on this layer through plasma treatment. An insulating material layer is then formed on the first doped silicon material layer. Subsequently, a second doped silicon material layer is created on the insulating material layer. The first doped silicon material layer is patterned into a first electrode, while the insulating material layer is patterned into an insulating layer. Finally, the second doped silicon material layer is patterned into a second electrode. This method aims to produce capacitors with improved reliability and enhanced capacitance density.

Career Highlights

Changda Yao is currently associated with United Microelectronics Corporation, where he continues to innovate in the field of semiconductor manufacturing. His expertise and dedication have made him a valuable asset to the company.

Collaborations

Changda has collaborated with notable colleagues, including Xiang Li and Ding Lung Chen, who share his commitment to advancing technology in the semiconductor industry.

Conclusion

Changda Yao's innovative approach to capacitor manufacturing exemplifies the impact of dedicated inventors in the technology sector. His contributions are paving the way for advancements in electronic components, ensuring better performance and reliability in future applications.

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