Chang-Sheng Chen

Title: Chang-Sheng Chen: Innovator in Semiconductor Packaging

Introduction

Chang-Sheng Chen is a prominent inventor based in Santa Clara, California. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a semiconductor package that features a die interposed between a cup-shaped lead frame and a lead frame with mesas and valleys. This design allows for a flip-chip style arrangement, where the lower lead frame has contacts aligned with the terminals on the bottom surface of the die. The upper lead frame contacts a terminal on the top side of the die, and its edges are bent downward around the die, creating a cup shape. This configuration ensures that all contacts of the package are coplanar, facilitating surface mounting on a printed circuit board. The terminals of the die are electrically connected to the lead frames through solder layers, with their thicknesses predetermined to optimize performance through thermal cycles. The lower lead frame is fabricated with a plurality of mesas, and a double solder reflow process is employed to enhance the package's reliability.

Career Highlights

Chang-Sheng Chen is currently associated with Siliconix Incorporated, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and performance of semiconductor packages.

Collaborations

He collaborates with talented coworkers, including Mohammed Kasem and King Owyang, who contribute to the innovative environment at Siliconix Incorporated.

Conclusion

Chang-Sheng Chen's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents not only enhance the performance of semiconductor devices but also pave the way for future advancements in the field.