This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2017-2018.
Company Filing History:
Years Active: 2017-2018
Title: Chang Lin - Innovator in Semiconductor Packaging
Introduction
Chang Lin is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the yield of TMI interconnections, which is crucial for the efficiency and reliability of electronic devices.
Latest Patents
One of Chang Lin's latest patents is titled "Package structure to enhance yield of TMI interconnections." This invention describes an apparatus that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are arranged around the semiconductor die on the substrate, each having a solid coating that contains a cleaning agent to promote coalescence with other solder balls. The design includes vias formed in the mold compound that expose the solder balls and their respective solid coatings. In various embodiments, the outer edges of the mold compound have a smaller thickness than the regions between the vias and the semiconductor die, and micro-channels may exist between the solder balls and the mold compound.
Career Highlights
Chang Lin is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has positioned him as a key player in advancing semiconductor packaging technologies.
Collaborations
Throughout his career, Chang Lin has collaborated with notable colleagues, including Rajen S Sidhu and Carl L Deppisch. These collaborations have contributed to the development of innovative solutions in the semiconductor industry.
Conclusion
Chang Lin's contributions to semiconductor packaging through his patents and work at Intel Corporation highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic device manufacturing.