Taipei, Taiwan

Chang-Jung Hsueh

This inventor holds 24 USPTO granted patents and 26 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Jung Hsueh. Retrieved from https://idiyas.com/inventor/chang-jung-hsueh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 95.8

Average Co-Inventor Count = 6.1

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2026

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Areas of Expertise:
Wire Bonding
Plasma Treatment
Conductive Bumps
Heat Dissipating Structures
Chip Structure
Stress-Resistant Bonding
Multi-Layer Structures
Semiconductor Device
Package Structure
Manufacturing Methods
Apparatus
Device Structure
24 patents (USPTO):Explore Patents

Title: Chang-Jung Hsueh: Pioneering Innovations in Semiconductor Packaging

Introduction

Chang-Jung Hsueh is a renowned inventor based in Taipei, Taiwan, with an impressive portfolio of 16 patents. His contributions to the field of semiconductor packaging have significantly advanced the industry, showcasing his expertise and innovative mindset.

Latest Patents

Among his latest inventions are two notable patents that illustrate his technical prowess. The first is titled "Package structure and method of forming the same." This patent describes a method involving a first package that includes a plurality of dies, where a series of sawing processes are performed to create specific package structures featuring a polygonal design with an increased number of nodes.

The second patent, "Package structure having lid with protrusion and manufacturing method thereof," details a semiconductor package comprising a substrate, semiconductor die, lid, and an adhesive layer. This innovative design utilizes a combination of metallic and polymeric thermal interface materials strategically placed to enhance the overall functionality and efficiency of the package.

Career Highlights

Chang-Jung Hsueh is currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he has made impactful contributions to the development of cutting-edge semiconductor technologies. His work has not only advanced the company's objectives but has also set new benchmarks within the industry.

Collaborations

Throughout his career, Chang-Jung has had the opportunity to collaborate with esteemed colleagues such as Hui-Min Huang and Wei-Hung Lin. These collaborations have fostered a creative environment that has driven innovation and resulted in several successful projects and patents.

Conclusion

In conclusion, Chang-Jung Hsueh exemplifies the spirit of innovation with his extensive patent portfolio and contributions to semiconductor technology. His groundbreaking work continues to influence the industry, and his collaborations with talented coworkers reflect a commitment to excellence and advancement in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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