Taipei, Taiwan

Chang-hung Yu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-hung Yu. Retrieved from https://idiyas.com/inventor/chang-hung-yu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chang-hung Yu: Semiconductor Invention and Patent Profile.

Introduction

Chang-hung Yu is an inventor based in Taipei, Taiwan. His patent work includes a semiconductor device and a method for testing it. The provided information identifies Taiwan Semiconductor Manufacturing Company Limited as his employer and lists 1 patent.

Latest Patents

Yu’s listed patent is “Semiconductor Device and Method of Testing the Same.” The disclosure describes a semiconductor device with a substrate containing a transistor and a surrounding seal ring. An interconnect structure lies over the transistor, and a recess is formed on a sidewall of the seal ring. A test pad in the interconnect structure extends to the seal-ring recess, providing a feature relevant to testing the device.

Career Highlights

The available information connects Yu’s semiconductor invention with Taiwan Semiconductor Manufacturing Company Limited. His listed patent focuses on device structure and testing.

Collaborations

Ruei-jyun Hsu is identified as Yu’s coworker. The provided details do not specify a particular joint patent or collaboration between them.

Conclusion

Chang-hung Yu’s listed patent addresses semiconductor-device testing through an interconnect test pad that extends to a recess in the seal ring.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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