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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Carlos A Gonzalez

USPTO Granted Patents = 14

Average Co-Inventor Count = 2.3

ph-index = 9

Forward Citations = 257(Granted Patents)


Company Filing History:

goldMedal14 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2003-2009

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14 patents (USPTO):Explore Patents
1. 7498678 - Electronic assemblies and systems with filled no-flow underfill (2009-03-03),
2. 7323360 - Electronic assemblies with filled no-flow underfill (2008-01-29),
3. 7235886 - Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby (2007-06-26),
4. 7199342 - Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy (2007-04-03),
5. 7122403 - Method of interconnecting die and substrate (2006-10-17),
6. 7096580 - I/C package/thermal-solution retention mechanism with spring effect (2006-08-29),
7. 6884943 - I/C package/ thermal-solution retention mechanism with spring effect (2005-04-26),
8. 6752634 - Contact array for semiconductor package (2004-06-22),
9. 6750551 - Direct BGA attachment without solder reflow (2004-06-15),
10. 6750549 - Variable pad diameter on the land side for improving the co-planarity of ball grid array packages (2004-06-15),
11. 6672892 - Package retention module coupled directly to a socket (2004-01-06),
12. 6657131 - I/C package / thermal-solution retention mechanism with spring effect (2003-12-02),
13. 6644536 - Solder reflow with microwave energy (2003-11-11),
14. 6600652 - Package retention module coupled directly to a socket (2003-07-29),

Title: Innovations by Carlos A Gonzalez

Introduction

Carlos A Gonzalez is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic assemblies and systems, holding a total of 14 patents. His work focuses on enhancing the reliability and efficiency of flip-chip integrated circuit (IC) packages.

Latest Patents

Gonzalez's latest patents include innovations in electronic assemblies and systems with filled no-flow underfill. These patents describe methods for achieving high yield and high reliability in flip-chip IC packages. The technology utilizes a combination of heat and pressure to bond flip-chip die and cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material, which decreases the CTE of the cured underfill. The filler material can be selected from a variety of substances, including silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, and aluminum nitride. Additionally, the filler material may increase the viscosity of the uncured underfill and enhance the modulus of elasticity of the cured underfill. Some method embodiments involve using a thermocompression bonder to simultaneously provide solder bump reflow and underfill curing.

Career Highlights

Carlos A Gonzalez is currently employed at Intel Corporation, where he continues to innovate in the field of electronic systems. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Gonzalez has collaborated with notable colleagues, including Biju Chandran and Leo Ofman, to further enhance the development of electronic assembly technologies.

Conclusion

Carlos A Gonzalez is a key figure in the field of electronic innovations, with a strong portfolio of patents that contribute to the advancement of flip-chip IC packages. His work at Intel Corporation exemplifies his commitment to improving electronic assembly technologies.

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