C Jerry Yang

Title: C Jerry Yang: Innovator in Chemical Mechanical Polishing

Introduction

C Jerry Yang is a notable inventor based in Mesa, AZ (US). He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of chemical mechanical polishing (CMP). His innovative work has led to the development of a patented technology that enhances the efficiency and effectiveness of wafer polishing processes.

Latest Patents

C Jerry Yang holds a patent for a multi-step chemical mechanical polishing system. This system is designed to polish a wafer to form metal interconnects in a dielectric layer. The process involves a first polish that removes an upper portion of the metal layer using a specific slurry and set of polishing parameters. This leaves residual metal within the dielectric layer to serve as the metal interconnects. A second polish then removes portions of the barrier layer, ensuring that the upper surface of the dielectric layer is cleared, thereby forming the metal interconnect. The innovative approach reduces dishing and dielectric erosion, making it a valuable advancement in the semiconductor industry.

Career Highlights

C Jerry Yang is associated with Speedfam-Ipec Corporation, where he has applied his expertise in CMP technology. His work has been instrumental in improving the processes used in semiconductor manufacturing, contributing to the efficiency and quality of the final products.

Collaborations

Throughout his career, C Jerry Yang has collaborated with notable colleagues, including Karey Holland and Ajoy Zutshi. These collaborations have fostered innovation and have played a crucial role in the development of advanced CMP technologies.

Conclusion

C Jerry Yang's contributions to the field of chemical mechanical polishing have made a significant impact on semiconductor manufacturing. His patented technology exemplifies innovation and efficiency, showcasing his role as a leading inventor in this specialized area.