Byung-Duk Na

Title: Byung-Duk Na: Innovator in Printed Circuit Board Technology

Introduction

Byung-Duk Na is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of printed circuit board technology. With a total of 2 patents to his name, Na continues to push the boundaries of innovation in this critical area of electronics.

Latest Patents

Na's latest patents include a method for manufacturing printed circuit boards. The first patent describes a printed circuit board that features an insulating layer with a via hole. This design incorporates a single layer metal pad, which has a center portion exposed by the via hole. Notably, the center portion of the pad exhibits higher roughness compared to the peripheral areas. The second patent outlines a printed circuit board that consists of an insulating material and a metal layer. This metal layer decreases in thickness near the via hole, enhancing the overall functionality of the board.

Career Highlights

Byung-Duk Na is currently employed at Samsung Electro-Mechanics Co., Ltd. His work at this leading company has allowed him to develop innovative solutions that address the evolving needs of the electronics industry. His expertise in printed circuit board technology has positioned him as a key player in this field.

Collaborations

Na has collaborated with talented coworkers, including Mi-Sun Hwang and Hye-Won Jung. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Byung-Duk Na's contributions to printed circuit board technology exemplify his commitment to innovation. His patents reflect a deep understanding of the complexities involved in electronic design. As he continues to work at Samsung Electro-Mechanics Co., Ltd., his future endeavors are sure to impact the industry positively.