The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Oct. 25, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Mi-Sun Hwang, Suwon-si, KR;
Hye-Won Jung, Suwon-si, KR;
Jae-Sung Sim, Suwon-si, KR;
Byung-Duk Na, Suwon-si, KR;
Hee-Joon Chun, Suwon-si, KR;
Sun-A Kim, Suwon-si, KR;
Deok-Man Kang, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 3/0017 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09736 (2013.01); H05K 2203/025 (2013.01);
Abstract
A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.