The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Nov. 05, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Byung-Duk Na, Suwon-si, KR;
Hye-Won Jung, Suwon-si, KR;
Jae-Sung Sim, Suwon-si, KR;
Mi-Sun Hwang, Suwon-si, KR;
Hee-Joon Chun, Suwon-si, KR;
Deok-Man Kang, Suwon-si, KR;
Sun-A Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/05 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/05 (2013.01); H05K 3/4038 (2013.01);
Abstract
A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.