Kyoto, Japan

Bungo Tanaka

USPTO Granted Patents = 22 

Average Co-Inventor Count = 1.5

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2013-2025

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22 patents (USPTO):Explore Patents

Title: Bungo Tanaka: Leading Innovator in Semiconductor Technology

Introduction

Bungo Tanaka, hailing from Kyoto, Japan, stands out in the field of semiconductor technology with a remarkable portfolio of 19 patents. His innovative contributions continue to shape modern electronic devices, significantly advancing their efficiency and performance.

Latest Patents

Among his most recent patents is a cutting-edge semiconductor device designed to enhance integration and functionality. This device features a semiconductor chip with a main surface, an insulating layer, and a functional device interlinked with low and high potential terminals. Additionally, the design incorporates a seal conductor, ensuring clear demarcation between functional regions within the semiconductor. Another patent by Tanaka focuses on an equally sophisticated semiconductor device, which includes a barrier electrode layer and a copper electrode layer coated with copper oxide. This configuration aims to improve the overall performance and durability of semiconductor applications.

Career Highlights

Bungo Tanaka has made significant strides throughout his career, primarily working with Rohm Co., Ltd. His dedication to advancing semiconductor technology through inventive approaches not only enhances product capabilities but also propels the industry forward.

Collaborations

Tanaka has collaborated with notable colleagues in the field, including Satoshi Kageyama and Keiji Wada. Together, they form a dynamic team, pushing the boundaries of innovation and exploring new frontiers in semiconductor development.

Conclusion

In conclusion, Bungo Tanaka's contributions to the semiconductor industry through his patents and collaborative efforts exemplify a commitment to innovation. His work significantly impacts technology, paving the way for future advancements in electronic devices.

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