The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Feb. 22, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Bungo Tanaka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01C 1/032 (2006.01); H01C 1/034 (2006.01); H01C 7/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01C 1/034 (2013.01); H01C 1/032 (2013.01); H01C 7/006 (2013.01); H05K 1/0298 (2013.01); H05K 1/185 (2013.01); H05K 2201/10022 (2013.01);
Abstract

An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.


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