The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 06, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Bungo Tanaka, Kyoto, JP;

Keiji Wada, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/40 (2026.01); H02P 23/00 (2016.01); H10W 20/47 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/497 (2026.01); H10W 20/47 (2026.01); H10W 90/00 (2026.01); H10W 90/811 (2026.01); H02P 23/00 (2013.01); H10W 72/019 (2026.01); H10W 72/01935 (2026.01); H10W 72/01938 (2026.01); H10W 72/5445 (2026.01); H10W 72/923 (2026.01); H10W 72/932 (2026.01); H10W 72/934 (2026.01); H10W 72/9415 (2026.01); H10W 72/9445 (2026.01); H10W 72/952 (2026.01); H10W 90/753 (2026.01); H10W 90/756 (2026.01);
Abstract

A semiconductor device includes a semiconductor layer that has a principal surface, a first conductive layer that is formed on the principal surface of the semiconductor layer, a first insulating portion that is formed on the principal surface of the semiconductor layer so as to cover the first conductive layer and that includes a first insulating layer of at least three or more layers, a second insulating portion that is formed on the first insulating portion, that has a dielectric constant differing from a dielectric constant of the first insulating layer, and that includes a second insulating layer not included in the first insulating portion, and a second conductive layer that is formed on the second insulating portion, that faces the first conductive layer through the first insulating portion and the second insulating portion, and that is connected to a potential differing from a potential of the first conductive layer.


Find Patent Forward Citations

Tanaka, Bungo. (2026). Semiconductor device, semiconductor module, motor drive device, and vehicle (U.S. Patent No. 12777925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777925

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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