This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2008-2009.
Company Filing History:
Years Active: 2008-2009
Title: The Innovations of Bun-Hin Keong
Introduction
Bun-Hin Keong is a notable inventor based in Muar, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
Bun-Hin Keong's latest patents include a chip-sized flip-chip semiconductor package and a method for making the same. This innovative semiconductor package comprises a semiconductor die with a plurality of contact areas on its active surface and an electrically conductive bump on each contact area. The die and electrically conductive bumps are encapsulated in a plastic housing, ensuring that the housing encapsulates at least the sides of the die and the sides of the electrically conductive bumps. Another patent involves a leadframe for use in a semiconductor package, which includes a die mounting area, a plurality of lead fingers, and a metal deposit with a negative electrochemical potential. This leadframe is designed to work in conjunction with a semiconductor chip, providing a robust solution for modern semiconductor packaging.
Career Highlights
Bun-Hin Keong is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role involves developing innovative technologies that push the boundaries of what is possible in the semiconductor industry. His contributions have been instrumental in advancing the company's product offerings.
Collaborations
Bun-Hin has collaborated with several talented individuals in his field, including Koh Hoo Goh and Abdul Rahman Mohamed. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Bun-Hin Keong's work in semiconductor technology exemplifies the spirit of innovation. His patents and contributions to Infineon Technologies AG highlight his commitment to advancing the field. His achievements serve as an inspiration for future inventors in the industry.