The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Jul. 12, 2006
Applicants:
Koh Hoo Goh, Muar Johor, MY;
Bun-hin Keong, Muar Johor, MY;
Abdul Rahman Mohamed, Johor, MY;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package () comprises a semiconductor die () with a plurality of contact areas () on its active surface and an electrically conductive bump () on each contact area (). The die () and electrically conductive bumps () are encapsulated in a plastic housing () so that the plastic housing () encapsulates at least sides of the die () and sides of the electrically conductive bumps ().