Infineon Technologies Ag

Bun-Hin Keong

Koh Hoo Goh

Abdul Rahman Mohamed

A semiconductor package () comprises a semiconductor die () with a plurality of contact areas () on its active surface and an electrically conductive bump () on each contact area (). The die () and electrically conductive bumps () are encapsulated in a plastic housing () so that the plastic housing () encapsulates at least sides of the die () and sides of the electrically conductive bumps ().

Chip-sized flip-chip semiconductor package and method for making the same

A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard Hhalf cell. A semiconductor package comprises the leadframe and a semiconductor chip having a plurality of contact areas mounted to the die mounting area and electrically connected to the inner ends of the lead fingers of the leadframe by a plurality of bond wires. The semiconductor chip, the bond wires and inner portions of the lead fingers are encapsulated by a plastic housing.

Growing community of inventors

Muar Johor, Malaysia

Bun-Hin Keong