Lincoln University, PA, United States of America

Bryan E Barton

USPTO Granted Patents = 7 

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2024

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7 patents (USPTO):Explore Patents

Title: Innovations of Bryan E. Barton in Chemical Mechanical Polishing

Introduction

Bryan E. Barton is a notable inventor based in Lincoln University, PA, who has made significant contributions to the field of chemical mechanical polishing (CMP). With a total of seven patents to his name, his work focuses on enhancing the efficiency and effectiveness of CMP pads used in various applications.

Latest Patents

Among his latest patents, Barton has developed formulations for chemical mechanical polishing pads that exhibit high planarization efficiency. One of his notable inventions involves CMP polishing pads made from a polyurethane reaction product. This product is derived from a mixture that includes a liquid aromatic isocyanate component and a liquid polyol component, which together create a highly efficient polishing pad. Another significant patent focuses on high porosity CMP pads with high hardness, designed to achieve a Shore DO hardness ranging from 40 to 80. This innovation utilizes a two-component reaction mixture that optimizes the performance of CMP pads.

Career Highlights

Barton is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc., where he continues to innovate and develop new materials for the electronics industry. His expertise in chemical engineering and materials science has positioned him as a key player in the advancement of CMP technologies.

Collaborations

Throughout his career, Barton has collaborated with several professionals in the field, including Teresa Brugarolas Brufau and Michael E. Mills. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Bryan E. Barton is a distinguished inventor whose work in chemical mechanical polishing has led to significant advancements in the industry. His innovative patents and contributions continue to shape the future of CMP technologies.

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