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For the Inventor, By the Inventor

Plantation, FL, United States of America

Bruce J Freyman

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.2

ph-index = 11

Forward Citations = 1,084(Granted Patents)


Location History:

  • N. Lauderdale, FL (US) (1987)
  • Sunrise, FL (US) (1991 - 1992)
  • Plantation, FL (US) (1992 - 1994)
  • Boca Raton, FL (US) (1995)

Company Filing History:

goldMedal11 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1987-1995

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11 patents (USPTO):Explore Patents
1. 5438224 - Integrated circuit package having a face-to-face IC chip arrangement (1995-08-01),
2. 5296738 - Moisture relief for chip carrier (1994-03-22),
3. 5241133 - Leadless pad array chip carrier (1993-08-31),
4. 5218759 - Method of making a transfer molded semiconductor device (1993-06-15),
5. 5166772 - Transfer molded semiconductor device package with integral shield (1992-11-24),
6. 5136366 - Overmolded semiconductor package with anchoring means (1992-08-04),
7. 5134462 - Flexible film chip carrier having a flexible film substrate and means (1992-07-28),
8. 5077633 - Grounding an ultra high density pad array chip carrier (1991-12-31),
9. 5006673 - Fabrication of pad array carriers from a universal interconnect structure (1991-04-09),
10. 4700473 - Method of making an ultra high density pad array chip carrier (1987-10-20),
11. 4700276 - Ultra high density pad array chip carrier (1987-10-13),

Title: Bruce J Freyman: Innovator in Integrated Circuit Technology

Introduction

Bruce J Freyman is a notable inventor based in Plantation, FL (US), recognized for his contributions to integrated circuit technology. With a total of 11 patents to his name, Freyman has made significant advancements in the field, particularly in the design and functionality of integrated circuit packages.

Latest Patents

Freyman's latest patents showcase his innovative approach to integrated circuit packaging. One of his notable inventions is an integrated circuit package featuring a face-to-face IC chip arrangement. This design includes a stacked integrated circuit chip arrangement placed on a circuit substrate, allowing for improved electrical connections among the chips. Another significant patent addresses moisture relief for chip carriers, which involves a semiconductor die mounted on a substrate with apertures to provide moisture relief during temperature fluctuations. These inventions reflect Freyman's commitment to enhancing the reliability and performance of integrated circuits.

Career Highlights

Freyman has spent a considerable part of his career at Motorola Corporation, where he has contributed to various projects and innovations in the field of electronics. His work has not only advanced the technology but has also set new standards in the industry.

Collaborations

Throughout his career, Freyman has collaborated with esteemed colleagues, including Barry M Miles and Frank J Juskey, Jr. These partnerships have fostered a creative environment that has led to groundbreaking innovations in integrated circuit technology.

Conclusion

In summary, Bruce J Freyman is a distinguished inventor whose work in integrated circuit technology has made a lasting impact. His innovative patents and contributions to Motorola Corporation highlight his expertise and dedication to advancing the field.

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