The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 1993

Filed:

Nov. 16, 1992
Applicant:
Inventors:

William B Mullen, III, Boca Raton, FL (US);

Glenn F Urbish, Coral Springs, FL (US);

Bruce J Freyman, Plantation, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H05K / ;
U.S. Cl.
CPC ...
174 524 ; 257787 ; 257693 ; 257774 ; 257786 ; 174 522 ; 361728 ; 361736 ; 361768 ; 361777 ;
Abstract

A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).


Find Patent Forward Citations

Mullen, III, William. (1993). Leadless pad array chip carrier (U.S. Patent No. 5241133). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5241133

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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