This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: Innovations by Brook D Ferney
Introduction
Brook D Ferney is an accomplished inventor based in Aloha, Oregon. He has made significant contributions to the field of wafer polishing technology. His innovative methods have the potential to enhance the efficiency and precision of wafer processing in the semiconductor industry.
Latest Patents
Brook D Ferney holds 1 patent for his invention titled "Wafer polishing control." This patent discloses methods of controlling the polishing of wafers. In one aspect, the method includes measuring one or more pre-polish thicknesses of one or more layers of a wafer. The layers are then polished, followed by measuring the post-polish thickness of a layer of the wafer. The polishing process is controlled using feed-forward control with the pre-polish thicknesses and feedback control with the post-polish thickness. Additionally, machine-accessible software to perform these methods is disclosed, along with systems in which these methods may be implemented.
Career Highlights
Brook D Ferney is currently employed at Intel Corporation, a leading company in the technology sector. His work focuses on advancing wafer polishing techniques, which are crucial for the production of high-quality semiconductor devices. His expertise in this area has positioned him as a valuable asset to his team and the company.
Collaborations
Brook has collaborated with talented coworkers, including Anju Narendra and Kimberly A Ryglelski. Their combined efforts contribute to the innovative projects at Intel Corporation, fostering a collaborative environment that drives technological advancements.
Conclusion
Brook D Ferney's contributions to wafer polishing technology exemplify the spirit of innovation in the semiconductor industry. His patent and ongoing work at Intel Corporation highlight the importance of precision in manufacturing processes.