Company Filing History:
Years Active: 2020-2024
Title: Brigham Navaja: Innovator in Hybrid Packaging Technology
Introduction
Brigham Navaja is a prominent inventor based in San Diego, CA, known for his contributions to hybrid packaging technology. With a total of 5 patents to his name, he has made significant strides in the field of electronics and semiconductor packaging.
Latest Patents
Navaja's latest patents include a "Hybrid package apparatus and method of fabricating." This invention features a hybrid package that consists of a die, a first substrate structure, and a first metallization structure that is at least partially coplanar with the substrate. The die is electrically coupled to the first metallization structure and the first substrate through a second metallization structure. The first metallization structure is designed to provide an electrical path for data signaling, while the second metallization structure serves as a ground plane coupled to a ground signal. Additionally, the first substrate structure is configured to provide an electrical path for power signaling. Another notable patent is the "Package comprising a die and die side redistribution layers (RDL)." This package includes a second redistribution portion, a die coupled to it, an encapsulation layer encapsulating the die, and a first redistribution portion located laterally to the die. Both redistribution portions are configured to provide one or more electrical paths for the die.
Career Highlights
Brigham Navaja is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work focuses on advancing packaging technologies that enhance the performance and efficiency of electronic devices.
Collaborations
Throughout his career, Navaja has collaborated with talented individuals such as Aniket Patil and Hong Bok We. These collaborations have contributed to the innovative solutions he has developed in the field of hybrid packaging.
Conclusion
Brigham Navaja's contributions to hybrid packaging technology have positioned him as a key inventor in the electronics industry. His innovative patents and work at Qualcomm Incorporated continue to influence advancements in semiconductor technology.