The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jun. 26, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Kuiwon Kang, San Diego, CA (US);

Brigham Navaja, San Diego, CA (US);

Marcus Hsu, San Diego, CA (US);

Terence Cheung, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4857 (2013.01); H01L 21/76897 (2013.01); H01L 23/49816 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 28/40 (2013.01);
Abstract

Certain aspects of the present disclosure generally relate to an embedded trace substrate (ETS) with one or more passive components embedded therein. Such an ETS may provide shorter routing, smaller loop area, and lower parasitics between a semiconductor die and a land-side passive component embedded in the ETS. One example embedded trace substrate generally includes a core, a first insulating material disposed above the core and having a first metal pattern embedded therein, a second insulating material disposed below the core and having a second metal pattern embedded therein, and one or more passive components embedded in the core.


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