The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Oct. 02, 2019
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Aniket Patil, San Diego, CA (US);

Brigham Navaja, San Diego, CA (US);

Hong Bok We, San Diego, CA (US);

Yuzhe Zhang, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3114 (2013.01); H01L 23/4951 (2013.01); H01L 23/5386 (2013.01); H01L 2224/02371 (2013.01);
Abstract

A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.


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