Elmira, OR, United States of America

Brian Evans


Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Brian Evans

Introduction

Brian Evans is a notable inventor based in Elmira, Oregon, recognized for his contributions to the field of electrochemistry. With a total of two patents to his name, his innovations are making significant strides in enhancing the efficiency and effectiveness of electroplating systems.

Latest Patents

Brian's recent patents include the "Rapidly Cleanable Electroplating Cup Seal" and the "Rapidly Cleanable Electroplating Cup Assembly." These inventions focus on closed-contact electroplating cup assemblies that allow for rapid cleaning while the electroplating system remains operational. One of his notable designs incorporates a cup assembly that features a tapered interior cup side, an opening seal, and multiple electrical contacts arranged around the opening. These design elements contribute to improved maintenance and operational efficiency in industrial settings.

Career Highlights

Brian Evans is associated with Novellus Systems Incorporated, where he applies his expertise in electroplating technology. His work at Novellus Systems has focused on developing innovative solutions that streamline processes and enhance the reliability of electroplating systems, making him a valuable asset to the company.

Collaborations

Throughout his career, Brian has collaborated with talented professionals in the field, including Shantinath Ghongadi and Robert Rash. Working alongside these esteemed colleagues has fostered an environment of innovation and creativity, leading to the development of his groundbreaking patents.

Conclusion

Brian Evans' inventive spirit is evident in his latest work that pushes the boundaries of electroplating technology. As he continues to develop innovative solutions at Novellus Systems Incorporated, his contributions promise to make significant impacts on the efficiency of manufacturing processes in the electroplating industry.

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