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Company Filing History:
Years Active: 2008-2025
Title: Innovations and Contributions of Brett Robert Herdendorf
Introduction
Brett Robert Herdendorf, a prolific inventor based in Mound, MN, is known for his remarkable contributions to the field of electroplating and connector technology. With a total of 61 patents to his name, his work showcases a keen understanding of the complexities involved in modern manufacturing processes.
Latest Patents
Among his latest innovations, Brett has developed groundbreaking technologies such as selective screen electroplating and connectors using shape memory alloy (SMA). The selective screen electroplating technology addresses the slow speed and complexity of conventional selective electroplating and L-PED. By employing a screen electroplating process, it achieves higher throughput and lower workpiece temperatures than traditional 3D printing methods, particularly in metal applications. This advancement positions his technology as a viable option for mass manufacturing of complex metallic three-dimensional objects. Furthermore, his work on connectors utilizing shape memory alloys allows for innovative actuator configurations. These connector devices can easily transition between open and closed states, significantly enhancing their utility in circuit board interconnections.
Career Highlights
Throughout his career, Brett Robert Herdendorf has made significant impacts while working at renowned companies such as Seagate Technology Incorporated. His expertise in electroplating and connector technology has paved the way for new manufacturing solutions, reflecting his status as a leader in the industry.
Collaborations
Brett has collaborated with talented professionals, including Riyan Alex Mendonsa and Krishnan Subramanian. Their teamwork has resulted in the development of innovative technologies that push the boundaries of existing manufacturing methods.
Conclusion
Brett Robert Herdendorf's contributions to innovation are evident in his extensive patent portfolio and his work with industry-leading companies. As he continues to pioneer advancements, his role in shaping the future of electroplating and connector technology remains crucial. His efforts not only serve the immediate needs of manufacturing but also lay the groundwork for future innovations.
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